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P6SMB62AT3G - onsemi

Description: 600 Watt Peak Power Zener Transient Voltage Suppressors

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P6SMB62AT3G - onsemi - PCB symbol
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PCB Footprints
P6SMB62AT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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3D Models
P6SMB62AT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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P6SMB62AT3G Details

  • Manufacturer Part Number:

    P6SMB62AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DO-214

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    65.1 V

  • Breakdown Voltage-Min:

    58.9 V

  • Breakdown Voltage-Nom:

    62 V

  • Clamping Voltage-Max:

    85 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    53 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

P6SMB62AT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for P6SMB62AT3G is a standard SMB package footprint with a pad size of 0.5 mm x 0.5 mm and a pitch of 1.25 mm. It's recommended to follow the PCB layout guidelines provided in the onsemi application note AND8325/D.
  • To ensure reliable soldering of P6SMB62AT3G, follow the recommended soldering profile provided in the onsemi application note AND8325/D. The recommended soldering temperature is 260°C with a dwell time of 10-30 seconds. It's also important to use a solder with a melting point above 217°C.
  • The maximum allowable voltage stress on P6SMB62AT3G is 1.5 times the rated voltage (62V) for a duration of less than 100 ms. However, it's recommended to follow the derating curve provided in the datasheet to ensure reliable operation.
  • P6SMB62AT3G is rated for operation up to 150°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to follow the derating curve provided in the datasheet and to ensure proper thermal management to prevent overheating.
  • P6SMB62AT3G is an ESD-sensitive device. To prevent damage, it's recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging.

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P6SMB62AT3G Overview

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P6SMB62AT3G Alternates

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Part Image P6SMB62AT3G Littelfuse Inc

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For a full list of alternate parts for P6SMB62AT3G, check out Findchips.com