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P6SMB82CAT3G - onsemi

Description: 600 Watt Peak Power Zener Transient Voltage Suppressors

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P6SMB82CAT3G - onsemi - PCB symbol
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PCB Footprints
P6SMB82CAT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03
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3D Models
P6SMB82CAT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03
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P6SMB82CAT3G Details

  • Manufacturer Part Number:

    P6SMB82CAT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DO-214

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403C-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    86.1 V

  • Breakdown Voltage-Min:

    77.9 V

  • Breakdown Voltage-Nom:

    82 V

  • Clamping Voltage-Max:

    113 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    70.1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

P6SMB82CAT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for P6SMB82CAT3G is a standard SMB footprint with a pad size of 0.5 mm x 0.5 mm and a spacing of 1.27 mm between pads. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To ensure the reliability of P6SMB82CAT3G in high-temperature applications, it's crucial to follow the recommended derating curves for voltage and current. Additionally, ensure proper thermal management by providing adequate heat sinking and airflow around the device.
  • Yes, you can use multiple P6SMB82CAT3G devices in parallel to increase the current handling capability. However, it's essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal gradients between devices.
  • The maximum surge current that P6SMB82CAT3G can withstand is 100 A for a duration of 10/1000 μs. It's essential to ensure that the device is not subjected to surge currents exceeding this rating to prevent damage or failure.
  • To select the correct P6SMB82CAT3G variant, consider the required breakdown voltage, peak pulse current, and clamping voltage for your application. The 'CAT3G' suffix indicates a 400 W rating, but there may be other variants with different ratings. Ensure you select the correct variant to meet your application's requirements.

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P6SMB82CAT3G Overview

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