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P82B96TD,118 - NXP

Description: Dual bidirectional bus buffer

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P82B96TD,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO8_
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P82B96TD,118 - NXP  - 3D model - Small Outline Packages - SO8_
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P82B96TD,118 Details

  • Manufacturer Part Number:

    P82B96TD,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

P82B96TD,118 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a metal shield around the device, ensure good grounding, and use a common mode choke or ferrite bead on the power lines. Also, follow the recommended PCB layout and decoupling capacitor placement.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation.
  • Use a heat sink or a thermal pad on the exposed pad of the device. Ensure good airflow around the device, and consider using a thermal interface material (TIM) for improved heat transfer.
  • The recommended clock frequency is 24 MHz, but the device can operate up to 32 kHz to 50 MHz. However, the optimal frequency depends on the specific application and requirements.

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P82B96TD,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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