P87LPC760BN,112 - NXP

P87LPC760BN,112 Details

• Manufacturer Part Number:

  P87LPC760BN,112

• Source Url Status Check Date:

  2013-06-14 00:00:00

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  DIP

• Package Description:

  0.300 INCH, PLASTIC, DIP-14

• Pin Count:

  14

• Manufacturer Package Code:

  SOT27-1

• HTS Code:

  8542.31.00.15

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  NO

• Additional Feature:

  ALSO OPERATES AT 2.7V MIN SUPPLY

• Bit Size:

  8

• Boundary Scan:

  NO

• CPU Family:

  8051

• Clock Frequency-Max:

  20 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• JESD-30 Code:

  R-PDIP-T14

• JESD-609 Code:

  e4

• Length:

  19.025 mm

• Number of I/O Lines:

  12

• Number of Terminals:

  14

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  70 °C

• PWM Channels:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  DIP

• Package Equivalence Code:

  DIP14,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Qualification Status:

  Not Qualified

• RAM (bytes):

  128

• ROM (words):

  1024

• ROM Programmability:

  OTPROM

• Seated Height-Max:

  4.2 mm

• Speed:

  20 MHz

• Supply Current-Max:

  25 mA

• Supply Voltage-Max:

  6 V

• Supply Voltage-Min:

  5 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  NICKEL PALLADIUM GOLD

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Width:

  7.62 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER