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P89LPC930FDH,129 - NXP

Description: plastic thin shrink small outline package; 28 leads; body width 4.4 mm.

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PCB Footprints
P89LPC930FDH,129 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP28 height 1.1
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3D Models
P89LPC930FDH,129 - NXP  - 3D model - Small Outline Packages - TSSOP28 height 1.1
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P89LPC930FDH,129 Details

  • Manufacturer Part Number:

    P89LPC930FDH,129

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP2

  • Package Description:

    4.40 MM, MO-153, SOT-361-1, PLASTIC, TSSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SOT361-1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    NO

  • Additional Feature:

    OPERATES AT 2.4V MINIMUM SUPPLY @ 12 MHZ

  • Bit Size:

    8

  • Clock Frequency-Max:

    18 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    26

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -45 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    18 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

P89LPC930FDH,129 Frequently Asked Questions (FAQs)

  • The maximum clock frequency is 12 MHz, but it can be overclocked up to 18 MHz with some limitations.
  • The power consumption in sleep mode is typically around 10 μA, but it can be as low as 5 μA depending on the configuration.
  • Yes, the P89LPC930FDH,129 is rated for industrial temperature ranges from -40°C to 85°C.
  • The maximum amount of flash memory that can be programmed is 60 KB, but it can be segmented into smaller blocks for more efficient use.
  • There are two UARTs available on the P89LPC930FDH,129, which can be used for serial communication.

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P89LPC930FDH,129 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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