P89LPC931FDH,112 - NXP

P89LPC931FDH,112 Details

• Manufacturer Part Number:

  P89LPC931FDH,112

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  TSSOP2

• Package Description:

  4.40 MM, MO-153, SOT-361-1, PLASTIC, TSSOP-28

• Pin Count:

  28

• Manufacturer Package Code:

  SOT361-1

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  NO

• Additional Feature:

  OPERATES AT 2.4V MINIMUM SUPPLY @ 12 MHZ

• Bit Size:

  8

• Boundary Scan:

  NO

• CPU Family:

  8051

• Clock Frequency-Max:

  18 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• JESD-30 Code:

  R-PDSO-G28

• JESD-609 Code:

  e4

• Length:

  9.7 mm

• Moisture Sensitivity Level:

  1

• Number of I/O Lines:

  26

• Number of Terminals:

  28

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -45 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP28,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  256

• ROM (words):

  8192

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.1 mm

• Speed:

  18 MHz

• Supply Current-Max:

  18 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3.3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  4.4 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER