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P89LPC934FDH,529 - NXP

Description: TSSOP28

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P89LPC934FDH,529 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
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P89LPC934FDH,529 - NXP  - 3D model - Small Outline Packages - TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for P89LPC934FDH,529
  • Part Number P89LPC934FDH,529
  • Manufacturer NXP
  • Pin Count 28
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
  • Released Date Aug 17, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

P89LPC934FDH,529 Details

  • Manufacturer Part Number:

    P89LPC934FDH,529

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP2

  • Package Description:

    4.40 MM, PLASTIC, MO-153, SOT-361-1, TSSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SOT361-1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    8

  • Boundary Scan:

    YES

  • CPU Family:

    8051

  • Clock Frequency-Max:

    12 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    2

  • Number of I/O Lines:

    26

  • Number of Terminals:

    28

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    768

  • ROM (words):

    8192

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    12 MHz

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

P89LPC934FDH,529 Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the P89LPC934FDH,529 is 12 MHz, but it can be overclocked up to 18 MHz with some limitations.
  • The oscillator can be configured using the OSCCFG register. The oscillator frequency can be set to either 12 MHz or 18 MHz, and the oscillator mode can be set to either XTAL or RC.
  • The watchdog timer is used to reset the microcontroller if it becomes stuck in an infinite loop or if there is a software fault. It can be enabled or disabled using the WDTE bit in the WDTMOD register.
  • The UART can be used for serial communication. The UART is configured using the UART registers, and the baud rate can be set using the UARTBSEL and UARTBREG registers.
  • The maximum current that can be sourced or sunk by the I/O pins is 20 mA per pin, with a total current limit of 100 mA for all I/O pins combined.

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P89LPC934FDH,529 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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