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PA1206FRE7W0R002Z - Yageo Group

Description: Current Sense Resistors - SMD 2 mOhms 1/2W 50PPM/C 1 % 1206 AEC-Q200

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PA1206FRE7W0R002Z - Yageo Group - PCB symbol
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PCB Footprints
PA1206FRE7W0R002Z - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - PA1206FRE7W0R002Z*
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PA1206FRE7W0R002Z - Yageo Group - 3D model - Resistor Chip - PA1206FRE7W0R002Z*
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PA1206FRE7W0R002Z Details

  • Manufacturer Part Number:

    PA1206FRE7W0R002Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    13

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.002 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.0316 V

PA1206FRE7W0R002Z Frequently Asked Questions (FAQs)

  • The recommended land pattern for PA1206FRE7W0R002Z is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • PA1206FRE7W0R002Z has a maximum operating temperature of 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
  • Yes, PA1206FRE7W0R002Z is compatible with lead-free soldering processes. YAGEO Corporation ensures that their components meet the requirements of the RoHS directive and are suitable for use in lead-free soldering applications.
  • PA1206FRE7W0R002Z has a moisture sensitivity level (MSL) of 2, which means it can withstand exposure to moisture for up to 4 days without requiring baking before reflow soldering.
  • PA1206FRE7W0R002Z is designed to operate in environments with relative humidity up to 85%. However, it's essential to ensure that the component is properly sealed and protected from moisture ingress to prevent degradation or failure.

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PA1206FRE7W0R002Z Overview

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