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PA2512FKE071U5E - Yageo Group

Description: YAGEO, PA2512_E, Metal, SMD Chip, 1.5 mOhms, 1%, 2512 / 6332

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PCB Footprints
PA2512FKE071U5E - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - 2512 (6432M)
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3D Models
PA2512FKE071U5E - Yageo Group  - 3D model - Resistor Chip - 2512 (6432M)
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PA2512FKE071U5E Details

  • Manufacturer Part Number:

    PA2512FKE071U5E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    9

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.63 mm

  • Package Length:

    6.35 mm

  • Package Style:

    SMT

  • Package Width:

    3.18 mm

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.0015 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL PLATE

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.0387 V

PA2512FKE071U5E Frequently Asked Questions (FAQs)

  • The recommended land pattern for PA2512FKE071U5E is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, PA2512FKE071U5E is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and to follow the recommended storage and handling procedures.
  • Yes, PA2512FKE071U5E is compatible with lead-free soldering processes. YAGEO Corporation uses a lead-free termination finish that meets the requirements of the RoHS directive.
  • The MSL of PA2512FKE071U5E is MSL 2, which means it can withstand exposure to moisture for up to 4 days without requiring baking before reflow soldering.
  • Yes, PA2512FKE071U5E is designed for high-frequency applications and has a self-resonant frequency of 100 MHz. However, it's essential to ensure that the component is properly decoupled and that the PCB layout is optimized for high-frequency operation.

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PA2512FKE071U5E Overview

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