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PAM8009DHR - Diodes Incorporated

Description: Audio Amplifiers

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PCB Footprints
PAM8009DHR - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-24 (Type TH)
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3D Models
PAM8009DHR - Diodes Incorporated  - 3D model - Small Outline Packages - SO-24 (Type TH)
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PAM8009DHR Details

  • Manufacturer Part Number:

    PAM8009DHR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    3

  • JESD-609 Code:

    e3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    MATTE TIN

PAM8009DHR Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure stable operation with a high-impedance speaker load, it is recommended to add a Zobel network (a series RC network) between the speaker and the PAM8009DHR output pins. This helps to dampen the speaker's inductive behavior and prevent oscillations.
  • Although the datasheet specifies a maximum VDD voltage of 5.5V, it is recommended to limit the voltage to 5V or less to ensure reliable operation and prevent damage to the device.
  • To minimize EMI emissions, it is recommended to use a shielded cable for the audio signal, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the power supply lines. Additionally, ensure that the device is properly decoupled with capacitors and that the ground plane is solid and unbroken.
  • The recommended input capacitor value for the PAM8009DHR is 1uF to 10uF, depending on the specific application and input signal characteristics. A larger capacitor value can help to filter out high-frequency noise, but may also increase the startup time of the device.

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