CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal pad on the bottom of the module can be connected to a heat sink or a thermal interface material to improve heat dissipation.
To ensure reliability and longevity, operate the module within the recommended temperature range (–40°C to +85°C). Implement proper thermal management, and avoid exposing the module to moisture, vibration, or physical stress. Regularly inspect the module for signs of wear or damage.
The maximum allowable voltage deviation for the input voltage is ±10% of the nominal input voltage. Exceeding this deviation may affect the module's performance, efficiency, or reliability.
Yes, the PBO-3-S3.3-B can be used in a redundant or parallel configuration to achieve higher power ratings or improved reliability. However, it's essential to ensure proper synchronization and control of the modules to avoid instability or damage.
The typical efficiency of the PBO-3-S3.3-B varies depending on the load condition. At 25°C, the efficiency is typically around 85% at full load, 80% at half load, and 75% at quarter load. Refer to the datasheet for detailed efficiency curves.
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PBO-3-S3.3-B Overview
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