PC28F512P30TFA - Micron

PC28F512P30TFA Details

• Manufacturer Part Number:

  PC28F512P30TFA

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  BGA-64

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Micron Technology Inc

• YTEOL:

  0

• Access Time-Max:

  100 ns

• Additional Feature:

  TOP BOOT

• Boot Block:

  TOP

• Command User Interface:

  YES

• Common Flash Interface:

  YES

• Data Polling:

  NO

• JESD-30 Code:

  R-PBGA-B64

• JESD-609 Code:

  e1

• Length:

  10 mm

• Memory Density:

  536870912 bit

• Memory IC Type:

  FLASH

• Memory Width:

  16

• Number of Functions:

  1

• Number of Sectors/Size:

  4,511

• Number of Terminals:

  64

• Number of Words:

  33554432 words

• Number of Words Code:

  32000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  32MX16

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TBGA

• Package Equivalence Code:

  BGA64,8X8,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE

• Page Size:

  16 words

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  1.8 V

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.2 mm

• Sector Size:

  16K,64K

• Standby Current-Max:

  0.000225 A

• Supply Current-Max:

  0.031 mA

• Supply Voltage-Max (Vsup):

  2 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Toggle Bit:

  NO

• Type:

  NOR TYPE

• Width:

  8 mm