PCA9509GM,125 - NXP

PCA9509GM,125 Details

• Manufacturer Part Number:

  PCA9509GM,125

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  QFN

• Package Description:

  1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8

• Pin Count:

  8

• Manufacturer Package Code:

  SOT902-1

• Country Of Origin:

  Thailand

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• Interface IC Type:

  BUS BUFFERS

• JESD-30 Code:

  S-PQCC-N8

• JESD-609 Code:

  e4

• Length:

  1.6 mm

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VQCCN

• Package Equivalence Code:

  LCC8,.06SQ,20

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.5 mm

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.55 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.6 mm