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PCA9601D,118 - NXP

Description: NXP - PCA9601D,118 - BUFFER, BIDIRECTIONAL, SOIC-8

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PCA9601D,118 - NXP - PCB symbol
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PCB Footprints
PCA9601D,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - PCA9601D,118
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3D Models
PCA9601D,118 - NXP - 3D model - Small Outline Packages - PCA9601D,118
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PCA9601D,118 Details

  • Manufacturer Part Number:

    PCA9601D,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

PCA9601D,118 Frequently Asked Questions (FAQs)

  • A good PCB layout for PCA9601D,118 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure EMC with PCA9601D,118, use a shielded enclosure, keep cables and connectors away from the device, and use a common-mode choke or ferrite bead on the input and output lines. Also, ensure that the PCB layout is optimized for EMC.
  • The maximum operating temperature range for PCA9601D,118 is -40°C to +125°C. However, the device can be operated at a reduced temperature range for specific applications, but this should be discussed with NXP Semiconductors.
  • Yes, PCA9601D,118 is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress.
  • To troubleshoot issues with PCA9601D,118, start by checking the power supply voltage, input and output signals, and PCB layout. Use oscilloscopes and logic analyzers to debug the issue. Consult the datasheet and application notes for guidance.

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PCA9601D,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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