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PCA9601DP,118 - NXP

Description: Dual bidirectional bus buffer

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PCB Footprints
PCA9601DP,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - NXP TSSOP8
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3D Models
PCA9601DP,118 - NXP  - 3D model - Small Outline Packages - NXP TSSOP8
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PCA9601DP,118 Details

  • Manufacturer Part Number:

    PCA9601DP,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT505-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

PCA9601DP,118 Frequently Asked Questions (FAQs)

  • A good PCB layout for PCA9601DP,118 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure EMC with PCA9601DP,118, use a shielded enclosure, keep cables and wires as short as possible, and use ferrite beads or common-mode chokes on cables. Also, ensure that the PCB layout is optimized for EMC, and use a common-mode filter if necessary.
  • The maximum operating temperature range for PCA9601DP,118 is -40°C to +125°C. However, the device can be operated at a reduced temperature range of -20°C to +85°C for most applications.
  • Yes, PCA9601DP,118 is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering procedures to ensure the device is securely attached to the PCB.
  • To troubleshoot issues with PCA9601DP,118, start by checking the power supply voltage, then verify the input and output signals using an oscilloscope. Check for any signs of overheating, and ensure that the device is properly soldered and mounted on the PCB.

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PCA9601DP,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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