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PCA9665APW,118 - NXP

Description: I/O Controller Interface IC Fm+ parallel bus I2C bus controller

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Symbol
PCA9665APW,118 - NXP - PCB symbol
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PCB Footprints
PCA9665APW,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-20
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3D Models
PCA9665APW,118 - NXP - 3D model - Small Outline Packages - TSSOP-20
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PCA9665APW,118 Details

  • Manufacturer Part Number:

    PCA9665APW,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TSSOP2

  • Package Description:

    4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOT360-1

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Address Bus Width:

    2

  • Bus Compatibility:

    I2C

  • Clock Frequency-Max:

    32 MHz

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, I2C

PCA9665APW,118 Frequently Asked Questions (FAQs)

  • A good thermal design should be used to ensure the device operates within the recommended temperature range. A minimum of 2oz copper thickness is recommended for the PCB, and thermal vias should be used to dissipate heat. A heat sink or thermal pad can also be used to improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design guidelines, use a heat sink or thermal pad, and ensure good airflow around the device. Additionally, the device should be operated within the recommended temperature range, and the junction temperature should be monitored to prevent overheating.
  • The recommended decoupling capacitors for the PCA9665APW,118 are 100nF and 10uF ceramic capacitors, which should be placed as close as possible to the device's power pins. These capacitors help to filter out noise and ensure stable operation.
  • To troubleshoot issues with the I2C interface, check the I2C bus voltage levels, clock frequency, and data transmission rates. Ensure that the I2C bus is properly terminated, and that there are no bus conflicts or signal integrity issues. Use an oscilloscope or logic analyzer to debug the I2C signals and identify any issues.
  • To protect the PCA9665APW,118 from electrostatic discharge (ESD), use ESD-sensitive handling procedures, such as wearing an ESD strap or using an ESD mat. Ensure that the device is stored in an ESD-protected environment, and that all equipment and tools used during handling and assembly are ESD-compliant.

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PCA9665APW,118 Overview

Use the download button to access the PCA9665APW,118 schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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