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PCA9665PW,118 - NXP

Description: Fm+ parallel bus to I2C-bus controller

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Symbol
PCA9665PW,118 - NXP - PCB symbol
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PCB Footprints
PCA9665PW,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT360-1_2025-2
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3D Models
PCA9665PW,118 - NXP - 3D model - Small Outline Packages - SOT360-1_2025-2
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PCA9665PW,118 Details

  • Manufacturer Part Number:

    PCA9665PW,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TSSOP2

  • Package Description:

    4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOT360-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Address Bus Width:

    2

  • Bus Compatibility:

    I2C

  • Clock Frequency-Max:

    1 MHz

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, I2C

PCA9665PW,118 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid ground plane on the PCB, and to place thermal vias under the IC to dissipate heat efficiently. Additionally, keeping the PCB layer stack-up symmetrical can help reduce thermal gradients.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a stable temperature.
  • For EMI and EMC compliance, consider using a shielded enclosure, keeping the PCB layout compact, and using decoupling capacitors to reduce noise. Additionally, ensure that the device is properly grounded, and use EMI filters or common-mode chokes to reduce emissions.
  • To troubleshoot I2C interface issues, start by verifying the I2C bus voltage and frequency. Check for proper termination, and ensure that the clock and data lines are not swapped. Use an oscilloscope to inspect the I2C signals, and verify that the device is properly addressed and configured.
  • Operating the device outside the recommended voltage range may affect its performance, reliability, and lifespan. Using a lower voltage may reduce the device's speed and functionality, while using a higher voltage may increase power consumption and reduce reliability.

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PCA9665PW,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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