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PCAL9722HN/Q900MP - NXP

Description: Interface - I/O Expanders Low-voltage translating 22-bit SPI I/O expander - AEC_Q100 compliant

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Symbol
PCAL9722HN/Q900MP - NXP - PCB symbol
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PCB Footprints
PCAL9722HN/Q900MP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN32.
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3D Models
PCAL9722HN/Q900MP - NXP - 3D model - Quad Flat No-Lead - HVQFN32.
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PCAL9722HN/Q900MP Details

  • Manufacturer Part Number:

    PCAL9722HN/Q900MP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Clock Frequency-Max:

    5 MHz

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    22

  • Number of I/O Lines:

    22

  • Number of Ports:

    3

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.85 mm

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    PARALLEL IO PORT, GENERAL PURPOSE

PCAL9722HN/Q900MP Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the PCAL9722HN/Q900MP application note (AN11542). It's essential to follow the guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The PCAL9722HN/Q900MP can be configured for I2C or SPI interface through the MODE pin. For I2C, connect the MODE pin to VCC, and for SPI, connect it to GND. Additionally, the device requires specific register settings for each interface, which can be found in the datasheet and application notes.
  • The PCAL9722HN/Q900MP can operate up to 100 MHz, but the maximum frequency depends on the specific application and system design. It's essential to consider factors like signal integrity, power consumption, and thermal management when operating at higher frequencies.
  • The PCAL9722HN/Q900MP has a thermal pad that must be connected to a thermal ground plane on the PCB to ensure proper heat dissipation. NXP recommends using a thermal interface material (TIM) and a heat sink if necessary, depending on the application's power consumption and operating conditions.
  • The PCAL9722HN/Q900MP requires a specific power-up and power-down sequencing to ensure proper operation and prevent damage. The datasheet provides guidelines for power sequencing, and it's essential to follow these recommendations to avoid issues like latch-up or damage to the device.

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PCAL9722HN/Q900MP Overview

Use the download button to access the PCAL9722HN/Q900MP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PCAL9, or try a keyword search, such as Parallel IO Ports

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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