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PCAL9722HNMP - NXP

Description: Interface - I/O Expanders Low-voltage translating 22-bit SPI I/O expander

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Symbol
PCAL9722HNMP - NXP - PCB symbol
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PCB Footprints
PCAL9722HNMP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT617-3_2022
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3D Models
PCAL9722HNMP - NXP - 3D model - Quad Flat No-Lead - SOT617-3_2022
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PCAL9722HNMP Details

  • Manufacturer Part Number:

    PCAL9722HNMP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Clock Frequency-Max:

    5 MHz

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    22

  • Number of I/O Lines:

    22

  • Number of Ports:

    3

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    PARALLEL IO PORT, GENERAL PURPOSE

PCAL9722HNMP Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the PCAL9722HNMP application note (AN11542). It's essential to follow the guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The PCAL9722HNMP can be configured for I2C or SPI interface through the MODE pin. For I2C, connect the MODE pin to VCC, and for SPI, connect it to GND. Additionally, the device requires specific register settings for each interface, which can be found in the datasheet and application notes.
  • The PCAL9722HNMP can operate up to 50 MHz in I2C mode and up to 20 MHz in SPI mode. However, the actual operating frequency may be limited by the system design, noise, and other factors. It's essential to consult the datasheet and application notes for specific frequency-related recommendations.
  • The PCAL9722HNMP has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow the thermal management guidelines in the datasheet and application notes to prevent overheating.
  • The PCAL9722HNMP has a built-in POR and BOD circuitry. The POR threshold is typically around 1.8 V, and the BOD threshold is around 1.7 V. These settings can be adjusted through register programming. Consult the datasheet and application notes for specific details on POR and BOD settings.

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PCAL9722HNMP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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