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PCN1-S12-S12-S - CUI Inc.

Description: Isolated DC/DC Converters - Through Hole 10.8-13.2Vin 12Vout 84mA 1W Iso SIP

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PCN1-S12-S12-S - CUI Inc. PCB footprint - Other - Other - PCN1-S12-S12-S
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PCN1-S12-S12-S - CUI Inc.  - 3D model - Other - PCN1-S12-S12-S
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PCN1-S12-S12-S Details

  • Manufacturer Part Number:

    PCN1-S12-S12-S

  • Brand Name:

    CUI Inc

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SIP-6/4

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2018-06-13

  • Manufacturer:

    CUI Inc

  • YTEOL:

    6

  • Analog IC - Other Type:

    DC-DC UNREGULATED POWER SUPPLY MODULE

  • Approvals:

    EN

  • Efficiency (Main Output):

    81%

  • Input Voltage-Max:

    13.2 V

  • Input Voltage-Min:

    10.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PSIP-T4

  • JESD-609 Code:

    e3

  • Length:

    19.75 mm

  • Line Regulation-Max:

    1.2%

  • Load Regulation-Max:

    10%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.084 A

  • Output Voltage-Max:

    12.36 V

  • Output Voltage-Min:

    11.64 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    PLASTIC

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP4/6,.06

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Protections:

    SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.0265125 Vrms

  • Seated Height-Max:

    10.45 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Total Power Output-Max:

    1 W

  • Trim/Adjustable Output:

    NO

  • Width:

    6.1 mm

PCN1-S12-S12-S Frequently Asked Questions (FAQs)

  • CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.
  • CUI recommends following the recommended PCB mounting and screw torque specifications to ensure the device is securely fastened. Additionally, using a conformal coating and potting the device can help improve reliability in high-vibration environments.
  • CUI recommends derating the input voltage by 10% to ensure reliable operation and to account for any voltage spikes or transients. This will help prevent damage to the device and ensure long-term reliability.
  • Yes, the PCN1-S12-S12-S can be used in a redundant or parallel configuration to improve system reliability and availability. However, it is essential to follow CUI's guidelines for paralleling and redundancy to ensure proper operation and to avoid any potential issues.
  • CUI provides an MTBF rating of 1.5 million hours at 25°C, calculated according to MIL-HDBK-217F. However, this rating may vary depending on the specific application and operating conditions.

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