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PD55003-E - STMicroelectronics

Description: RF power transistor from the LdmoST plastic family of N-channel enhancement-mode lateral MOSFETs

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PD55003-E - STMicroelectronics PCB footprint - Other - Other - PowerSO-10RF (formed lead)_2024
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PD55003-E - STMicroelectronics  - 3D model - Other - PowerSO-10RF (formed lead)_2024
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PD55003-E Details

  • Manufacturer Part Number:

    PD55003-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    ROHS COMPLIANT, PLASTIC, POWERSO-10RF, 2 PIN

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    2.5 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2.4 pF

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    165 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    31.7 W

  • Power Gain-Min (Gp):

    14 dB

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

PD55003-E Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and thermal dissipation.
  • The PD55003-E has a high power dissipation, so thermal management is crucial. Use a heat sink with a thermal interface material, ensure good airflow, and follow the recommended PCB layout to minimize thermal resistance. Monitor the junction temperature (TJ) and adjust the design accordingly.
  • To ensure EMI and EMC compliance, follow the recommended PCB layout, use a shielded enclosure, and implement proper filtering and shielding techniques. Additionally, consider using a common-mode choke and a Y-capacitor to reduce EMI emissions.
  • Choose input and output capacitors with low ESR, high ripple current rating, and suitable voltage ratings. Consider using X7R or X5R dielectric capacitors, and ensure the capacitors are placed close to the PD55003-E to minimize parasitic inductance.
  • The soft-start time should be set based on the specific application requirements. For overcurrent protection, set the threshold based on the maximum expected current and ensure the response time is suitable for the application. Refer to the datasheet and application notes for more information.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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