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PD55025-E - STMicroelectronics

Description: RF POWER transistor, LdmoST plastic family N-channel enhancement-mode, lateral MOSFETs

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PD55025-E - STMicroelectronics - PCB symbol
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PD55025-E - STMicroelectronics PCB footprint - Other - Other - PD55025-E-6
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PD55025-E Details

  • Manufacturer Part Number:

    PD55025-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    ROHS COMPLIANT, PLASTIC, POWERSO-10RF, 2 PIN

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.7

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    7 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5.8 pF

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    165 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    225

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    79 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

PD55025-E Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and thermal dissipation.
  • The PD55025-E has a high power dissipation, so thermal management is crucial. Use a heat sink with a thermal interface material, ensure good airflow, and follow the recommended PCB layout to minimize thermal resistance. Monitor the junction temperature (TJ) to prevent overheating.
  • The input capacitors should be low-ESR, high-frequency capacitors with a voltage rating of at least 50V. A minimum capacitance of 10uF is recommended, with a maximum ESR of 100mΩ. X7R or X5R dielectric types are suitable for this application.
  • Consult the datasheet and application notes for configuration guidelines. Pay attention to the input voltage range, output voltage settings, and current limits. Use the STMicroelectronics evaluation board or a similar setup to test and validate your configuration before implementing it in your design.
  • Follow the recommended PCB layout and component placement to minimize EMI. Use a shielded enclosure, and ensure proper grounding and decoupling. Implement EMI filters and shielding on the input and output lines as needed. Consult the application notes and relevant standards (e.g., CISPR 22) for compliance guidelines.

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PD55025-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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