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PD69220C-022419 - Microchip

Description: Power Switch ICs - POE / LAN

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PCB Footprints
PD69220C-022419 - Microchip PCB footprint - Other - Other - 32 Pin QFN 5 mm × 5 mm
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3D Models
PD69220C-022419 - Microchip  - 3D model - Other - 32 Pin QFN 5 mm × 5 mm
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PD69220C-022419 Details

  • Manufacturer Part Number:

    PD69220C-022419

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    VFLGA-32

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    PSE CONTROLLER

PD69220C-022419 Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow Microchip's guidelines for PCB layout and thermal management. This includes using a 4-layer PCB with a solid ground plane, placing decoupling capacitors close to the device, and using thermal vias to dissipate heat. Additionally, ensure good airflow around the device to prevent overheating.
  • To ensure EMC compliance, follow Microchip's guidelines for PCB layout, component selection, and shielding. Use a metal shield around the device, and ensure that all cables and connectors are properly shielded. Additionally, follow good EMC design practices, such as minimizing loop areas and using common-mode chokes.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) first, followed by the input voltage (VIN). For power-down, reverse the sequence. Ensure that the power supply voltage is stable before applying the input voltage. Refer to the datasheet for specific timing requirements.
  • To troubleshoot issues, start by verifying the power supply voltage and input voltage levels. Check for proper PCB layout and component selection. Use an oscilloscope to monitor the device's output and input signals. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • The thermal limitations and derating factors for this device are specified in the datasheet. The device is rated for operation up to 125°C junction temperature. Derating factors apply above 85°C. Ensure that the device is properly cooled, and follow the recommended thermal management guidelines to prevent overheating.

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PD69220C-022419 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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