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PDIUSBD12PW,112 - NXP

Description: USB Interface IC USB I-FACE

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PCB Footprints
PDIUSBD12PW,112 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
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3D Models
PDIUSBD12PW,112 - NXP  - 3D model - Small Outline Packages - TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for PDIUSBD12PW,112
  • Part Number PDIUSBD12PW,112
  • Manufacturer NXP
  • Pin Count 28
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
  • Released Date Jan 18, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

PDIUSBD12PW,112 Details

  • Manufacturer Part Number:

    PDIUSBD12PW,112

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM , PLASTIC, MO-153, SOT-361-1, TSSOP-28

  • Pin Count:

    28

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • Additional Feature:

    ALSO OPERATES AT 4 TO 5.5V SUPPLY

  • Address Bus Width:

    1

  • Bus Compatibility:

    80C51

  • Clock Frequency-Max:

    6 MHz

  • Data Transfer Rate-Max:

    1 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    9.7 mm

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

PDIUSBD12PW,112 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the USB traces as short as possible and away from noise sources. Use a common mode filter or ferrite bead to reduce EMI.
  • Follow the USB 2.0 specification guidelines for device design, including signal integrity, jitter, and voltage drop. Use a USB 2.0 compliant PHY and ensure the device is enumerated correctly.
  • The PDIUSBD12PW,112 has a low power consumption of 100 μA in suspend mode. Use a power management IC to regulate voltage and current. Consider using a low-dropout regulator (LDO) for voltage regulation.
  • Use ESD protection diodes or a dedicated ESD protection IC to protect the device from electrostatic discharge. Ensure the ESD protection circuit is designed to meet the IEC 61000-4-2 standard.
  • The device has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB. Use thermal vias or a heat sink if necessary to maintain a safe operating temperature.

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PDIUSBD12PW,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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