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PESD3V3X1BL,315 - Nexperia

Description: PESD3V3X1BL - Ultra low capacitance bidirectional ESD protection diode

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PCB Footprints
PESD3V3X1BL,315 - Nexperia PCB footprint - Other - Other - SOD882
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3D Models
PESD3V3X1BL,315 - Nexperia  - 3D model - Other - SOD882
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PESD3V3X1BL,315 Details

  • Manufacturer Part Number:

    PESD3V3X1BL,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    3

  • Breakdown Voltage-Max:

    7.8 V

  • Breakdown Voltage-Min:

    5 V

  • Breakdown Voltage-Nom:

    6.3 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-60134; IEC-61000-4-2; MIL-STD-883

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

PESD3V3X1BL,315 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for PESD3V3X1BL,315 is -40°C to 125°C.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C. Also, ensure the PCB is designed with a suitable thermal pad and solder mask to prevent solder bridging.
  • For optimal performance, it is recommended to use a symmetrical PCB layout with a solid ground plane, and to keep the signal traces as short as possible. Also, ensure that the device is placed close to the protected IC to minimize the distance between them.
  • Yes, the PESD3V3X1BL,315 is AEC-Q101 qualified, making it suitable for use in automotive applications. However, ensure that the device is used within the specified operating conditions and that the PCB design meets the required safety standards.
  • The correct package orientation for PESD3V3X1BL,315 is marked on the device itself. The marking indicates the pin 1 location, and the device should be oriented accordingly on the PCB.

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PESD3V3X1BL,315 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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