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PHPT61003PYX - Nexperia

Description: Transistor PNP 100V 3A Auto LFPAK56

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PCB Footprints
PHPT61003PYX - Nexperia PCB footprint - Other - Other - LFPAK56; PowerSO8 (SOT669)_2022_1
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3D Models
PHPT61003PYX - Nexperia  - 3D model - Other - LFPAK56; PowerSO8 (SOT669)_2022_1
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PHPT61003PYX Details

  • Manufacturer Part Number:

    PHPT61003PYX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOT-669, SOP-8, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    3 A

  • Collector-Base Capacitance-Max:

    30 pF

  • Collector-Emitter Voltage-Max:

    100 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    150

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    25 W

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    125 MHz

  • VCEsat-Max:

    0.33 V

PHPT61003PYX Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, avoid overheating, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Follow standard ESD precautions during handling and assembly. Use an ESD wrist strap or mat, and ensure the PCB has ESD protection diodes on sensitive inputs.
  • Yes, but ensure you follow the recommended operating conditions, and consider additional testing and validation according to the specific industry standards (e.g., AEC-Q100 for automotive).
  • Consult the datasheet and application notes for troubleshooting guidelines. Use oscilloscopes and logic analyzers to debug issues. If needed, contact Nexperia's technical support for further assistance.

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PHPT61003PYX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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