The recommended land pattern for PHT0805Y1002BGT is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While PHT0805Y1002BGT is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at the operating temperature. Additionally, the solder joints and PCB material should be suitable for high-temperature operation.
To prevent ESD damage, handle PHT0805Y1002BGT with ESD-safe materials, such as wrist straps, mats, and bags. Ensure that the PCB and assembly process also follow ESD-safe practices. If you're concerned about ESD, consider adding ESD protection components to your design.
The recommended soldering profile for PHT0805Y1002BGT is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
While PHT0805Y1002BGT is not hermetically sealed, it is designed to operate in a normal environment. However, if your application involves high humidity or moisture, consider adding conformal coating or potting to protect the component and PCB from corrosion.
Trust Checks
This model has been verified by system checks.
System Verified
Sponsored
PHT0805Y1002BGT Overview
Use the download button to access the PHT0805Y1002BGT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PHT08,
or try a keyword search, such as Fixed Resistors
