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PI7C9X3G808GPBHFCEX - Diodes Incorporated

Description: Packet Switch, 8-Port/8-Lane Interface 196-HFCBGA (15x15)

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PI7C9X3G808GPBHFCEX - Diodes Incorporated PCB footprint - BGA - BGA - 196-pin HFCBGA 15mm x 15mm
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PI7C9X3G808GPBHFCEX - Diodes Incorporated  - 3D model - BGA - 196-pin HFCBGA 15mm x 15mm
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PI7C9X3G808GPBHFCEX Details

  • Manufacturer Part Number:

    PI7C9X3G808GPBHFCEX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HFCBGA-196

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Bus Compatibility:

    I2C; PCI; SMBUS

  • Clock Frequency-Max:

    100 MHz

  • JESD-30 Code:

    S-PBGA-B196

  • Length:

    15 mm

  • Number of Terminals:

    196

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TR

  • Seated Height-Max:

    2.94 mm

  • Supply Voltage-Max:

    0.99 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, I2C

PI7C9X3G808GPBHFCEX Frequently Asked Questions (FAQs)

  • The PI7C9X3G808GPBHFCEX has an operating temperature range of -40°C to 85°C.
  • To ensure signal integrity, it is recommended to use a signal integrity analysis tool to simulate the signal transmission and optimize the PCB design. Additionally, using a low-loss PCB material, minimizing trace lengths, and using signal termination resistors can help maintain signal integrity.
  • The recommended power-up sequence for the PI7C9X3G808GPBHFCEX is to power up the VCCIO and VCC cores simultaneously, followed by the input clocks. This ensures proper device initialization and prevents potential latch-up conditions.
  • To handle hot-swapping with the PI7C9X3G808GPBHFCEX, it is recommended to use a hot-swap controller or a power switch with inrush current limiting to prevent voltage droop and ensure reliable operation.
  • For optimal performance, it is recommended to follow a star-topology layout for the power and ground pins, and to route the high-speed signals away from the power and ground planes. Additionally, using a 4-layer PCB with a solid ground plane can help reduce noise and improve signal integrity.

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PI7C9X3G808GPBHFCEX Overview

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