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PIC16F15214-E/P - Microchip

Description: 8-bit Microcontrollers - MCU 7KB Flash, 512B RAM, 10b ADC, 2x PWM, 2x CCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP SLEEP Mode

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PIC16F15214-E/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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PIC16F15214-E/P - Microchip  - 3D model - Dual-In-Line Packages - 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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PIC16F15214-E/P Details

  • Manufacturer Part Number:

    PIC16F15214-E/P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDIP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES AT 1.8V MIN @ 16 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC16

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.271 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    6

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    8

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    512

  • ROM (words):

    7168

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    5.334 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    3.6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC16F15214-E/P Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the PIC16F15214-E/P is 32 MHz, but it can be overclocked to 48 MHz with a reduced voltage range.
  • The internal oscillator of the PIC16F15214-E/P can be configured using the OSCCON register. The oscillator frequency can be set to 31 kHz, 125 kHz, 250 kHz, 500 kHz, 1 MHz, 2 MHz, 4 MHz, or 8 MHz.
  • The maximum current that can be sourced by the I/O pins of the PIC16F15214-E/P is 25 mA, and the maximum current that can be sunk is 25 mA. However, the total current sourced or sunk by all I/O pins should not exceed 200 mA.
  • The ADC of the PIC16F15214-E/P can be used by configuring the ADCON0 and ADCON1 registers. The ADC can operate in 8-bit or 10-bit mode, and can convert analog signals from 12 channels.
  • The brown-out reset (BOR) feature of the PIC16F15214-E/P is used to reset the microcontroller when the supply voltage falls below a certain threshold. This feature helps to prevent the microcontroller from operating erratically or unpredictably during power-on or power-down sequences.

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PIC16F15214-E/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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