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PIC16F18156-I/STX - Microchip

Description: 8-bit Microcontrollers - MCU 28KB Flash, 2KB RAM, 128B EEPROM, 12b Diff. ADCC, 2x16-bit dual PWM

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PIC16F18156-I/STX - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 28-Lead Very Thin Plastic Quad Flat, No Lead (STX) - 4x4x1.0 mm Body [VQFN]With 2.65x2.65 mm Exposed Pad
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3D Models
PIC16F18156-I/STX - Microchip  - 3D model - Quad Flat No-Lead - 28-Lead Very Thin Plastic Quad Flat, No Lead (STX) - 4x4x1.0 mm Body [VQFN]With 2.65x2.65 mm Exposed Pad
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for PIC16F18156-I/STX
  • Part Number PIC16F18156-I/STX
  • Manufacturer Microchip
  • Pin Count 29
  • Part Category Integrated Circuit
  • Package Category Quad Flat No-Lead
  • Footprint Name Quad Flat No-Lead - 28-Lead Very Thin Plastic Quad Flat, No Lead (STX) - 4x4x1.0 mm Body [VQFN]With 2.65x2.65 mm Exposed Pad
  • Released Date Apr 22, 2025
  • Last Modified Date Apr 22, 2025 8:52 AM UTC
  • Pinout / Pin List Click Here (Member Only)

PIC16F18156-I/STX Details

  • Manufacturer Part Number:

    PIC16F18156-I/STX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    VQFN-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.15

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES WITH 1.8V MIN@ 16 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC16

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    25

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    28

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    2048

  • ROM (words):

    28672

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    6.1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC16F18156-I/STX Frequently Asked Questions (FAQs)

  • The PIC16F18156-I/STX can operate at a maximum clock frequency of 32 MHz.
  • The PIC16F18156-I/STX has 28 KB of flash memory.
  • Yes, the PIC16F18156-I/STX has a low-power sleep mode that can reduce power consumption to as low as 20 nA.
  • Yes, the PIC16F18156-I/STX has 12-bit ADCs with up to 24 channels.
  • Yes, the PIC16F18156-I/STX is rated for operation up to 125°C (industrial temperature range).

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PIC16F18156-I/STX Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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