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PIC18F2480-E/SO - Microchip

Description: MCU 16K Flash 768 RAM ECAN SOIC28

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PCB Footprints
PIC18F2480-E/SO - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 28-LAED PLASTIC SMALL OUTLINE  (SO) -WIDE, 7.50MM BODY [SOIC]
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3D Models
PIC18F2480-E/SO - Microchip  - 3D model - Small Outline Packages - 28-LAED PLASTIC SMALL OUTLINE  (SO) -WIDE, 7.50MM BODY [SOIC]
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PIC18F2480-E/SO Details

  • Manufacturer Part Number:

    PIC18F2480-E/SO

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    7.50 MM HEIGHT, LEAD FREE, PLASTIC, SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SOIC-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Has ADC:

    YES

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC18

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    3

  • Number of I/O Lines:

    25

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    28

  • Number of Timers:

    6

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    768

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.65 mm

  • Speed:

    40 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC18F2480-E/SO Frequently Asked Questions (FAQs)

  • The PIC18F2480-E/SO can operate at a maximum clock frequency of 40 MHz.
  • The PIC18F2480-E/SO consumes approximately 0.1 μA in sleep mode, depending on the specific configuration and operating conditions.
  • Yes, the PIC18F2480-E/SO is designed to operate in industrial temperature ranges (-40°C to +125°C) and can withstand harsh environments, but it's essential to follow proper design and layout guidelines to ensure reliability.
  • Microchip provides a bootloader implementation guide and example code for the PIC18F2480-E/SO. You can use the Microchip XC8 compiler and MPLAB X IDE to develop and debug your bootloader application.
  • Yes, the PIC18F2480-E/SO is 5V tolerant, but it's recommended to use a 3.3V power supply for optimal performance and to reduce power consumption. If you must use a 5V power supply, ensure that you follow proper voltage regulation and decoupling guidelines.

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PIC18F2480-E/SO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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