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PIC18F26Q84-E/5N - Microchip

Description: 8-bit Microcontrollers - MCU CAN, 128KB Flash, 13KB RAM, 12b ADC3, UTMR, DAC, Comp, PWM, CCP, CWG, HLT, WWDT,

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PCB Footprints
PIC18F26Q84-E/5N - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 28-Lead Very Thin Plastic Quad Flat, No Lead Package (5NX) - 6x6x1.0 mm Body [VQFN] 4.10x4.10 mm Exposed
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3D Models
PIC18F26Q84-E/5N - Microchip  - 3D model - Quad Flat No-Lead - 28-Lead Very Thin Plastic Quad Flat, No Lead Package (5NX) - 6x6x1.0 mm Body [VQFN] 4.10x4.10 mm Exposed
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for PIC18F26Q84-E/5N
  • Part Number PIC18F26Q84-E/5N
  • Manufacturer Microchip
  • Pin Count 29
  • Part Category Integrated Circuit
  • Package Category Quad Flat No-Lead
  • Footprint Name Quad Flat No-Lead - 28-Lead Very Thin Plastic Quad Flat, No Lead Package (5NX) - 6x6x1.0 mm Body [VQFN] 4.10x4.10 mm Exposed
  • Released Date Jan 19, 2025
  • Last Modified Date Jan 19, 2025 8:34 AM UTC
  • Pinout / Pin List Click Here (Member Only)

PIC18F26Q84-E/5N Details

  • Manufacturer Part Number:

    PIC18F26Q84-E/5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    VQFN-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.15

  • Factory Lead Time:

    1 Week

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Has ADC:

    YES

  • Bit Size:

    8

  • Boundary Scan:

    YES

  • CPU Family:

    PIC18

  • Clock Frequency-Max:

    64 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    3

  • Number of I/O Lines:

    25

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    28

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.24SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • RAM (bytes):

    8192

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    64 MHz

  • Supply Current-Max:

    13.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC18F26Q84-E/5N Frequently Asked Questions (FAQs)

  • The PIC18F26Q84-E/5N can operate at a maximum clock frequency of 64 MHz.
  • The PIC18F26Q84-E/5N has 32 KB of flash memory.
  • Yes, the PIC18F26Q84-E/5N has a low-power sleep mode that can reduce power consumption to as low as 20 nA.
  • No, the PIC18F26Q84-E/5N does not have built-in USB functionality. However, it can be used with external USB controllers or modules.
  • Yes, the PIC18F26Q84-E/5N is rated for operation in industrial temperature ranges from -40°C to +85°C.

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PIC18F26Q84-E/5N Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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