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PIC24FJ256GU408-E/PT - Microchip

Description: 16-Bit eXtreme Low-Power Microcontrollers with LCD Controller and USB

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PIC24FJ256GU408-E/PT - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm [TQFP]
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PIC24FJ256GU408-E/PT - Microchip  - 3D model - Quad Flat Packages - 80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm [TQFP]
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PIC24FJ256GU408-E/PT Details

  • Manufacturer Part Number:

    PIC24FJ256GU408-E/PT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-80

  • Pin Count:

    80

  • Manufacturer Package Code:

    TQFP-80

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2020-06-02

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Has ADC:

    YES

  • Additional Feature:

    ITS ALSO AVAILABLE WITH 17-CH 10-BIT ADC

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    PIC24

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    6

  • Number of External Interrupts:

    4

  • Number of I/O Lines:

    69

  • Number of Terminals:

    80

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP80,.47SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • RAM (bytes):

    32768

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Speed:

    32 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC24FJ256GU408-E/PT Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the PIC24FJ256GU408-E/PT is 32 MHz, but it can be overclocked to 40 MHz with a reduced voltage supply.
  • The oscillator configuration is done using the FOSCSEL (Oscillator Select) and FOSCEN (Oscillator Enable) bits in the OSCCON (Oscillator Control) register. Refer to the datasheet for the specific bit settings for different oscillator modes.
  • The maximum current that can be sourced by an I/O pin is 25 mA, and the maximum current that can be sunk is 50 mA. However, the total current sourced/sunk by all I/O pins should not exceed 200 mA.
  • The internal oscillator can be enabled by setting the INTOSC (Internal Oscillator) bit in the OSCCON register. The internal oscillator frequency can be selected using the IOSCFS (Internal Oscillator Frequency Select) bits in the OSCCON register.
  • The PPS feature allows peripherals to be remapped to different I/O pins, providing flexibility in pin assignment and reducing the need for external multiplexers.

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PIC24FJ256GU408-E/PT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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