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PIC32MX150F256L-I/PF - Microchip

Description: 32-bit Microcontrollers - MCU 256KB Flash 32KB RAM I2S, CTMU, UART, ADC

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PIC32MX150F256L-I/PF - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-LEAD PLASTIC THIN QUAD FLATPACK (PF) - 14x14x1 mm BODY , 2.00mm [TQFP]
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PIC32MX150F256L-I/PF - Microchip  - 3D model - Quad Flat Packages - 100-LEAD PLASTIC THIN QUAD FLATPACK (PF) - 14x14x1 mm BODY , 2.00mm [TQFP]
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PIC32MX150F256L-I/PF Details

  • Manufacturer Part Number:

    PIC32MX150F256L-I/PF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    TQFP-100

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Date Of Intro:

    2016-04-14

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Has ADC:

    YES

  • Additional Feature:

    3KB BOOT FLASH AVAILABLE

  • Address Bus Width:

    16

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    85

  • Number of Terminals:

    100

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    32

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • RAM (words):

    8192

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Speed:

    50 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MX150F256L-I/PF Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the PIC32MX150F256L-I/PF is 50 MHz, but it can be overclocked to 80 MHz with a reduced voltage.
  • The oscillator can be configured using the FOSCSEL and POSCMD bits in the CONFIG3 register. The oscillator can be set to use an external crystal, internal FRC, or external clock source.
  • The PIC32MX150F256L-I/PF has 64 KB of RAM, but only 56 KB is available for user programs due to the reserved space for the stack and other system functions.
  • Yes, the PIC32MX150F256L-I/PF can operate with a power supply voltage between 2.3V and 3.6V, making it compatible with 3.3V systems.
  • The PIC32MX150F256L-I/PF can be programmed using the MPLAB X IDE and a programmer/debugger such as the PICkit 3 or ICD 3. The device can also be programmed using the ICSP (In-Circuit Serial Programming) interface.

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PIC32MX150F256L-I/PF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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