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PIC32MX210F016D-I/ML - Microchip

Description: 32-bit Microcontrollers - MCU PIC32 16KB FL 4KBRAM 40MHz USB CTMU 4 DMA

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PCB Footprints
PIC32MX210F016D-I/ML - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 44-Lead Plastic Quad Flat, No Lead Package(ML) - 8x8 mm Body [QFN]
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3D Models
PIC32MX210F016D-I/ML - Microchip  - 3D model - Quad Flat No-Lead - 44-Lead Plastic Quad Flat, No Lead Package(ML) - 8x8 mm Body [QFN]
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PIC32MX210F016D-I/ML Details

  • Manufacturer Part Number:

    PIC32MX210F016D-I/ML

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    8 X 8 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    QFN-44

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N44

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    6

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    33

  • Number of Terminals:

    44

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC44,.32SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • RAM (words):

    4096

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Speed:

    40 MHz

  • Supply Current-Max:

    37 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MX210F016D-I/ML Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the PIC32MX210F016D-I/ML is 50 MHz, but it can be overclocked to 60 MHz with reduced voltage and temperature ranges.
  • The oscillator can be configured using the FOSCSEL and POSCMD bits in the OSCCON register. The oscillator type (e.g., internal, external, or crystal) and frequency can be selected using these bits.
  • The PIC32MX210F016D-I/ML has 16 KB of flash memory and 4 KB of RAM.
  • The DMA controller can be used to transfer data between peripherals and memory without CPU intervention. The DMA controller is configured using the DMA registers, and the transfer is triggered by a peripheral request or a software trigger.
  • The remap function allows the boot loader to be remapped to a different address, allowing the boot loader to be updated or replaced without affecting the application code.

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PIC32MX210F016D-I/ML Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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