Please enter a minimum 3 letters or numbers
Technical Content
Part Image

PIC32MX270F256B-50I/SP - Microchip

Description: Microchip PIC32MX270F256B-50I/SP, 32bit PIC Microcontroller, 50MHz, 256 kB Flash, 28-Pin SPDIP

Download PIC32MX270F256B-50I/SP Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
PIC32MX270F256B-50I/SP - Microchip - PCB symbol
click to zoom
PCB Footprints
PIC32MX270F256B-50I/SP - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 28-Lead Skinny Plastic Dual In-Line (SP) - 300mil Body [SPDIP]
click to zoom
3D Models
PIC32MX270F256B-50I/SP - Microchip - 3D model - Dual-In-Line Packages - 28-Lead Skinny Plastic Dual In-Line (SP) - 300mil Body [SPDIP]
click to zoom

PIC32MX270F256B-50I/SP Details

  • Manufacturer Part Number:

    PIC32MX270F256B-50I/SP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SDIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SPDIP-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Has ADC:

    YES

  • Additional Feature:

    THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDIP-T28

  • JESD-609 Code:

    e3

  • Length:

    34.671 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    6

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    19

  • Number of Terminals:

    28

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • RAM (bytes):

    65536

  • RAM (words):

    65536

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    5.08 mm

  • Speed:

    50 MHz

  • Supply Current-Max:

    37 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MX270F256B-50I/SP Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with an external crystal oscillator is 50 MHz, as specified in the datasheet. However, it's recommended to use a crystal oscillator with a frequency of 8 MHz or 12 MHz for optimal performance and to ensure that the device meets its specifications.
  • To configure the oscillator for optimal performance, you should follow the guidelines provided in the datasheet and the Microchip oscillator configuration guide. This includes selecting the correct oscillator mode, configuring the oscillator pins, and ensuring that the oscillator is properly bypassed and decoupled.
  • The maximum amount of current that can be sourced or sunk by the I/O pins is 25 mA per pin, as specified in the datasheet. However, it's recommended to limit the current to 10 mA per pin to ensure that the device operates within its specifications and to prevent overheating.
  • To implement a reliable bootloader for the PIC32MX270F256B-50I/SP, you should follow the guidelines provided in the Microchip bootloader implementation guide. This includes selecting a suitable bootloader architecture, implementing a secure bootloader protocol, and ensuring that the bootloader is properly tested and validated.
  • The PIC32MX270F256B-50I/SP has several power-saving features, including sleep modes and peripheral shutdown. To minimize power consumption, you should use these features judiciously, optimize your code for low power operation, and ensure that the device is properly configured for low power operation.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

PIC32MX270F256B-50I/SP Overview

Use the download button to access the PIC32MX270F256B-50I/SP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PIC32, or try a keyword search, such as Microcontrollers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

Parts related to PIC32MX270F256B-50I/SP

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑