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PIC32MX360F512L-80V/BG - Microchip

Description: 32-bit Microcontrollers - MCU 512 KB FL 32 KB RAM 80MHz 10-Bit ADC DMA

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PIC32MX360F512L-80V/BG - Microchip PCB footprint - BGA - BGA - (BG)121-Lead(XBGA)
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PIC32MX360F512L-80V/BG - Microchip  - 3D model - BGA - (BG)121-Lead(XBGA)
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PIC32MX360F512L-80V/BG Details

  • Manufacturer Part Number:

    PIC32MX360F512L-80V/BG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    XBGA-121

  • Pin Count:

    121

  • Manufacturer Package Code:

    TFBGA-121

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B121

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    85

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    121

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA121,11X11,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Speed:

    80 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MX360F512L-80V/BG Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be achieved with an external crystal oscillator is 80 MHz, as specified in the datasheet. However, it's recommended to consult the crystal oscillator manufacturer's datasheet to ensure the oscillator can operate at the desired frequency.
  • To configure the USB module to work in device mode, you need to set the UCFG register to enable device mode, configure the USB clock, and set the USB address. Refer to the Microchip USB Stack documentation and the PIC32MX360F512L datasheet for detailed instructions.
  • The maximum amount of current that can be sourced or sunk by the GPIO pins is 25 mA per pin, as specified in the datasheet. However, it's recommended to limit the current to 10-15 mA per pin to ensure reliable operation and prevent overheating.
  • To implement a bootloader using the PIC32MX360F512L, you need to create a custom bootloader that can communicate with a host PC, receive firmware updates, and program the device's flash memory. Microchip provides a bootloader example code and documentation to help you get started.
  • The minimum power supply voltage required for the PIC32MX360F512L to operate is 2.3V, as specified in the datasheet. However, it's recommended to use a power supply voltage of at least 3.0V to ensure reliable operation and prevent brownout reset.

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PIC32MX360F512L-80V/BG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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