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PIC32MX764F128L-I/PF - Microchip

Description: 32-bit Microcontrollers - MCU 128KB 32KBRM 80MHz USB CAN ETH 4DMA

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PIC32MX764F128L-I/PF - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body
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PIC32MX764F128L-I/PF Details

  • Manufacturer Part Number:

    PIC32MX764F128L-I/PF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    TQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    TQFP-100

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Date Of Intro:

    2016-09-20

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    83

  • Number of Terminals:

    100

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • RAM (words):

    32768

  • ROM (words):

    143360

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Speed:

    80 MHz

  • Supply Current-Max:

    98 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MX764F128L-I/PF Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the PIC32MX764F128L-I/PF is 80 MHz, but it can be overclocked to 120 MHz with a reduced voltage and temperature range.
  • The oscillator can be configured using the FOSCSEL and FWDTEN bits in the CONFIG2 register. The oscillator type (e.g. internal, external crystal, or external clock) and frequency range (e.g. high, medium, or low) can be selected using these bits.
  • The PIC32MX764F128L-I/PF has 128 KB of Flash memory and 16 KB of RAM.
  • The DMA controller can be used to transfer data between peripherals and memory without CPU intervention. The DMA controller is configured using the DMAxCON, DMAxREQ, and DMAxSTAT registers. The DMA channel must be enabled, and the transfer size, source, and destination addresses must be specified.
  • The remap function allows the boot loader or application code to remap the data space to a different location in memory. This is useful for boot loader applications where the boot loader code needs to be relocated to a different address to make room for the application code.

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PIC32MX764F128L-I/PF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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