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PIC32MX775F256H-80I/PT - Microchip

Description: 64 PINS, 256KB Flash, USB, ENET, 2xCAN

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PIC32MX775F256H-80I/PT - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - (PT)64-Lead(TQFP)
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PIC32MX775F256H-80I/PT - Microchip  - 3D model - Quad Flat Packages - (PT)64-Lead(TQFP)
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PIC32MX775F256H-80I/PT Details

  • Manufacturer Part Number:

    PIC32MX775F256H-80I/PT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    TQFP-64

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    51

  • Number of Terminals:

    64

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP64,.47SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • RAM (words):

    65536

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Speed:

    80 MHz

  • Supply Current-Max:

    98 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MX775F256H-80I/PT Frequently Asked Questions (FAQs)

  • The internal oscillator can operate up to 8 MHz, but the maximum clock frequency depends on the specific configuration and the device's operating voltage. Refer to the datasheet for more information.
  • To configure the USB module in device mode, you need to set the UCFG register to enable device mode, configure the USB clock, and set up the endpoint registers. Refer to the USB module chapter in the datasheet for more information.
  • The maximum current that can be sourced or sunk by the GPIO pins is 25 mA. However, it's recommended to limit the current to 10 mA to ensure reliable operation.
  • To use the DMA controller, you need to configure the DMA channel, set up the transfer parameters, and enable the DMA transfer. Refer to the DMA controller chapter in the datasheet for more information.
  • The minimum voltage required for the device to operate is 2.3V, but it's recommended to operate the device at 3.3V for optimal performance.

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PIC32MX775F256H-80I/PT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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