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PIC32MZ2064DAG169T-I/6J - Microchip

Description: 32-bit Microcontrollers - MCU 32-bit cache-based MCU, Graphics Integrated, stacked DDR2

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PIC32MZ2064DAG169T-I/6J - Microchip PCB footprint - BGA - BGA - 169-Ball Low Profile Ball Grid Array (6JX) - 11x11 mm Body [LFBGA]
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PIC32MZ2064DAG169T-I/6J - Microchip  - 3D model - BGA - 169-Ball Low Profile Ball Grid Array (6JX) - 11x11 mm Body [LFBGA]
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PIC32MZ2064DAG169T-I/6J Details

  • Manufacturer Part Number:

    PIC32MZ2064DAG169T-I/6J

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Pin Count:

    169

  • Manufacturer Package Code:

    LFBGA-169

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    5 Weeks

  • Date Of Intro:

    2018-09-28

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    64 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B169

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    120

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    169

  • Number of Timers:

    13

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA169,13X13,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • ROM (words):

    2048

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.56 mm

  • Speed:

    200 MHz

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MZ2064DAG169T-I/6J Frequently Asked Questions (FAQs)

  • The PIC32MZ2064DAG169T-I/6J can operate from -40°C to +85°C (industrial temperature range) and -40°C to +125°C (extended temperature range) with reduced performance.
  • The clock source can be configured using the FOSCSEL fuse bits in the device configuration words. The options include internal Fast RC Oscillator (FRC), internal Low Power RC Oscillator (LPRC), primary oscillator (XT or HS), or external clock source.
  • The maximum frequency for the CPU is 200 MHz, and the peripherals can operate at a maximum frequency of 100 MHz.
  • The PIC32MZ2064DAG169T-I/6J has 2 MB of flash memory available for programming, with 16 KB of boot flash and 2 KB of EEPROM data memory.
  • The typical power consumption of the PIC32MZ2064DAG169T-I/6J is 350 mA at 200 MHz, 3.3V, and 25°C. The sleep current is typically 10 μA, and the deep sleep current is typically 1 μA.

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PIC32MZ2064DAG169T-I/6J Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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