Fastron recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A minimum of 1 oz copper thickness is recommended. For more information, refer to the Fastron application note AN-001.
Fastron recommends following the JEDEC J-STD-020D.1 standard for reflow soldering. The device is sensitive to temperature and humidity, so ensure the storage and handling guidelines are followed. A peak reflow temperature of 260°C should not be exceeded.
The device is rated for operation from -40°C to 125°C. However, the maximum junction temperature (Tj) should not exceed 150°C. Derating is required for operation above 100°C.
Yes, the device is designed to withstand vibrations up to 10g (10-2000 Hz). However, it's essential to ensure the PCB is properly secured and the device is soldered correctly to prevent mechanical stress.
Fastron recommends using X7R or X5R dielectric capacitors with a minimum capacitance of 10uF for the input and output. The capacitor should be placed as close as possible to the device pins.
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PISG-2R2M-01 Overview
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