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PL123-02NGI-R - Microchip

Description: Clock Buffer Programmable DC , 200MHz 1:2 Fan-Out Buffer

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PL123-02NGI-R - Microchip - PCB symbol
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PCB Footprints
PL123-02NGI-R - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6-Lead Ultra Thin Dual Flat, No Lead Package (HXA) - 1.3x2x0.60 mm Body [UDFN] Micrel Legacy Package TDF
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PL123-02NGI-R - Microchip - 3D model - Small Outline No-lead - 6-Lead Ultra Thin Dual Flat, No Lead Package (HXA) - 1.3x2x0.60 mm Body [UDFN] Micrel Legacy Package TDF
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for PL123-02NGI-R
  • Part Number PL123-02NGI-R
  • Manufacturer Microchip
  • Pin Count 7
  • Part Category Integrated Circuit
  • Package Category Small Outline No-lead
  • Footprint Name Small Outline No-lead - 6-Lead Ultra Thin Dual Flat, No Lead Package (HXA) - 1.3x2x0.60 mm Body [UDFN] Micrel Legacy Package TDF
  • Released Date Dec 17, 2025
  • Last Modified Date Dec 17, 2025 1:44 PM UTC
  • Pinout / Pin List Click Here (Member Only)

PL123-02NGI-R Details

  • Manufacturer Part Number:

    PL123-02NGI-R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Family:

    PL123

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    1.62 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Width:

    1.3 mm

PL123-02NGI-R Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a reliable communication protocol like SPI or I2C, and ensure proper signal termination and impedance matching. Also, implement error detection and correction mechanisms to handle data transmission errors.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Also, follow the recommended PCB layout guidelines to minimize thermal resistance.
  • Follow the recommended power-up and power-down sequences to avoid latch-up or damage. Use a low-dropout regulator (LDO) or a switching regulator to provide a stable voltage supply, and ensure the input voltage is within the recommended range.
  • Handle the device with ESD-protective equipment and follow proper handling procedures. Use ESD protection devices like TVS diodes or ESD arrays on the PCB to protect the device from electrostatic discharge.

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PL123-02NGI-R Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image PL123-02NGI Microchip Technology Inc

Programmable DC , 200MHz 1:2 Fan-Out Buffer