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PL133-37TC-R - Microchip

Description: Clock Buffer Low-Power, 1MHz to 150MHz, 1:3 Fanout Buffer

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PCB Footprints
PL133-37TC-R - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - PL902
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3D Models
PL133-37TC-R - Microchip  - 3D model - SOT23 (6-Pin) - PL902
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PL133-37TC-R Details

  • Manufacturer Part Number:

    PL133-37TC-R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Family:

    PL133

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Number of True Outputs:

    3

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.35 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    1.62 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.6 mm

PL133-37TC-R Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1.5 mm via diameter for optimal thermal performance.
  • Implement a robust power-on reset circuit, ensure a stable clock source, and use a reliable voltage regulator. Also, consider using a thermistor or thermocouple to monitor temperature and adjust system parameters accordingly.
  • Use a multi-layer PCB with a solid ground plane, add EMI filters on I/O lines, and consider using TVS diodes or ESD protection devices. Ensure proper PCB layout, component placement, and shielding to minimize EMI and ESD risks.
  • Use the device's low-power modes, optimize clock frequencies, and minimize I/O activity. Consider using a low-dropout regulator and optimizing the power supply design to minimize quiescent current.
  • Use a development board or a compatible evaluation board, and consider using a debug adapter or an in-circuit debugger. Ensure proper firmware initialization, and use a version control system to track changes and collaborate with team members.

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PL133-37TC-R Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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