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PLA133-67OAVAO - Microchip

Description: Clock Buffer Automotive 1:6 Low Skew Fanout Buffer

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PLA133-67OAVAO - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-16LD-PL-1
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PLA133-67OAVAO Details

  • Manufacturer Part Number:

    PLA133-67OAVAO

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP, TSSOP16,.25

  • Pin Count:

    16

  • Manufacturer Package Code:

    TSSOP-16

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Family:

    PLA133

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.008 A

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Power Supply Current-Max (ICC):

    32 mA

  • Propagation Delay (tpd):

    9.2 ns

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

PLA133-67OAVAO Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the PLA133-67OAVAO evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance.
  • The PLA133-67OAVAO has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane.
  • The PLA133-67OAVAO is rated for operation from -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed +150°C to ensure reliability and prevent damage.
  • The PLA133-67OAVAO has a power-down mode that can be enabled by asserting the PD pin low. Additionally, the device's clock frequency can be reduced to minimize power consumption. Refer to the datasheet for specific power-down mode and clock frequency settings.
  • Microchip recommends using 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 10 V or higher, placed as close as possible to the device's power pins to filter out noise and ensure stable operation.

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PLA133-67OAVAO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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