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PLED13Q12 - LITTELFUSE

Description: LED Protection Devices LED PROTECTOR Bi 13V QFN 3X3 2L RoHS

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PCB Footprints
PLED13Q12 - LITTELFUSE PCB footprint - Other - Other - QFN (3x3)
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3D Models
PLED13Q12 - LITTELFUSE  - 3D model - Other - QFN (3x3)
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PLED13Q12 Details

  • Manufacturer Part Number:

    PLED13Q12

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.6

  • Breakover Voltage-Max:

    26 V

  • Breakover Voltage-Min:

    13 V

  • Configuration:

    SINGLE

  • JESD-30 Code:

    S-PBCC-N2

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    SILICON SURGE PROTECTOR

PLED13Q12 Frequently Asked Questions (FAQs)

  • A good PCB layout for PLED13Q12 involves keeping the leads as short as possible, using a solid ground plane, and placing the device close to the protected circuit. Additionally, ensure that the PCB material has a high thermal conductivity to dissipate heat efficiently.
  • To select the correct PLED13Q12 variant, consider the maximum voltage, current, and power requirements of your application. Check the datasheet for the available variants and their corresponding specifications. You can also consult with a Littelfuse representative or a qualified engineer for guidance.
  • Proper thermal management is crucial for PLED13Q12. Ensure good airflow around the device, and consider using a heat sink or thermal interface material to reduce thermal resistance. The device's thermal pad should be soldered to a solid copper plane on the PCB to facilitate heat dissipation.
  • Yes, PLED13Q12 is suitable for high-reliability and safety-critical applications. It meets various industry standards, such as AEC-Q101, and is designed to provide robust overvoltage protection. However, it's essential to follow proper design and testing procedures to ensure the device meets the specific requirements of your application.
  • To troubleshoot issues with PLED13Q12, start by verifying the device's pinout and connections. Check for proper voltage and current ratings, and ensure the device is not overheating. Use a multimeter to measure voltage and current at the device's pins, and consult the datasheet for guidance on troubleshooting common issues.

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PLED13Q12 Overview

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