The recommended land pattern for PLT0603Z2002AST5 is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
PLT0603Z2002AST5 is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet for specific derating information and ensure that the component is suitable for your application's temperature requirements.
PLT0603Z2002AST5 is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. Follow the recommended storage and handling procedures outlined in the datasheet, and ensure that the component is baked or dried according to the manufacturer's instructions before use.
The recommended soldering profile for PLT0603Z2002AST5 is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. Consult the datasheet for specific soldering profile recommendations and ensure that your soldering process meets these requirements.
PLT0603Z2002AST5 is designed to withstand moderate vibration levels, but it's recommended to evaluate the component's performance in your specific application. Consider the component's termination style, PCB design, and mounting method to ensure that it can withstand the expected vibration levels.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
PLT0603Z2002AST5 Overview
Use the download button to access the PLT0603Z2002AST5 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PLT06,
or try a keyword search, such as Thin Film Resistors
