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PLZ6V2C-G3/H - Vishay

Description: Zener Diodes 500mW PLZ Zener MicroSMF (DO-219AC)

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PLZ6V2C-G3/H - Vishay PCB footprint - Other - Other - PLZ6V2C-G3/H-2
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PLZ6V2C-G3/H - Vishay  - 3D model - Other - PLZ6V2C-G3/H-2
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PLZ6V2C-G3/H Details

  • Manufacturer Part Number:

    PLZ6V2C-G3/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMF, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Date Of Intro:

    2017-03-21

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JEDEC-95 Code:

    DO-219AC

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.34 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Reference Voltage-Nom:

    6.2 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2.55%

  • Working Test Current:

    20 mA

PLZ6V2C-G3/H Frequently Asked Questions (FAQs)

  • The recommended land pattern for PLZ6V2C-G3/H is available in the Vishay Intertechnologies' 'Land Pattern Recommendations' document, which can be found on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder paste requirements for optimal assembly and reliability.
  • Proper thermal management is crucial for the PLZ6V2C-G3/H. Ensure good thermal conductivity by using a thermal pad or thermal interface material (TIM) between the device and the heat sink. The heat sink should be designed to provide adequate airflow and heat dissipation. Additionally, follow the recommended PCB layout and thermal design guidelines provided by Vishay Intertechnologies.
  • The maximum allowable voltage derating for PLZ6V2C-G3/H is typically 80% of the rated voltage. However, it's recommended to consult with Vishay Intertechnologies' application engineers or refer to their voltage derating guidelines for specific applications and environmental conditions.
  • Yes, the PLZ6V2C-G3/H is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the device's parasitic capacitance, inductance, and resistance when designing the circuit. Additionally, ensure that the PCB layout and component selection are optimized for high-frequency operation.
  • To ensure the reliability of PLZ6V2C-G3/H in harsh environments, follow Vishay Intertechnologies' guidelines for environmental testing, such as temperature cycling, humidity, and vibration. Additionally, consider using conformal coating, potting, or other environmental protection methods to protect the device from moisture, dust, and other contaminants.

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