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PM1210-560J-RC - Bourns

Description: Inductor RF Molded Bobbin Core 56uH 5% 2.52MHz 30Q-Factor Ferrite 0.055A 8Ohm DCR 1210 T/R

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PM1210-560J-RC - Bourns PCB footprint - Inductor Moulded - Inductor Moulded - PM1210-3R9J-RC
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PM1210-560J-RC - Bourns  - 3D model - Inductor Moulded - PM1210-3R9J-RC
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PM1210-560J-RC Details

  • Manufacturer Part Number:

    PM1210-560J-RC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    5.5

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    8 Ω

  • Inductance-Nom (L):

    56 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.2 mm

  • Package Length:

    2.9 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.055 A

  • Self Resonance Frequency:

    13 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    J BEND

  • Tolerance:

    5%

PM1210-560J-RC Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • Bourns recommends using a soldering iron with a temperature range of 250°C to 260°C and a solder with a melting point of 180°C to 190°C. The component should be soldered within 3 seconds to 5 seconds to prevent thermal damage.
  • Although the datasheet specifies an operating temperature range of -40°C to 125°C, Bourns recommends derating the component's performance at temperatures above 100°C to ensure long-term reliability.
  • Bourns recommends handling the component in an ESD-controlled environment, using ESD-protective packaging, and grounding personnel and equipment to prevent electrostatic discharge damage.
  • Bourns recommends storing the component in its original packaging, in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -20°C to 40°C, and the humidity should be below 60%.

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PM1210-560J-RC Overview

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