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PM3700-70-RC - Bourns

Description: Common Mode Chokes / Filters 10mH MIN

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PCB Footprints
PM3700-70-RC - Bourns PCB footprint - Other - Other - PM3700-70-RC-1
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3D Models
PM3700-70-RC - Bourns  - 3D model - Other - PM3700-70-RC-1
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PM3700-70-RC Details

  • Manufacturer Part Number:

    PM3700-70-RC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, SMD, 4 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • Additional Feature:

    TAPE AND REEL

  • Attenuation Frequency-Max:

    5 MHz

  • Attenuation@Freq-Max:

    20 dB

  • DC Resistance-Max:

    0.15 Ω

  • Diameter:

    17.78 mm

  • Filter Type:

    DATA LINE FILTER

  • Height:

    11.43 mm

  • Inductance:

    10000 µH

  • JESD-609 Code:

    e1

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    2

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Packing Method:

    TAPE AND REEL

  • Rated Current:

    1.5 A

  • Terminal Finish:

    TIN SILVER COPPER

PM3700-70-RC Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure proper thermal management, minimize parasitic inductance, and optimize performance.
  • To select the correct inductor value, consider factors such as operating frequency, current requirements, and desired inductance value. Bourns provides inductor selection guides and online tools to help with this process.
  • The PM3700-70-RC has an operating temperature range of -40°C to +125°C. However, it's essential to consider derating factors, such as current and temperature, to ensure reliable operation.
  • Yes, Bourns recommends following standard SMT assembly and soldering guidelines. It's essential to use a soldering profile that minimizes thermal stress and ensures reliable connections.
  • To ensure EMC, follow proper PCB layout and shielding techniques, and consider using additional components, such as common-mode chokes or EMI filters, to minimize electromagnetic interference.

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