Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize parasitic inductance and capacitance.
Ensure good airflow around the inductor, and consider using a thermal pad or heat sink if the application requires high current or high ambient temperatures.
The PM5022-3R3M-RC is designed to handle voltage stress up to 1.5 times the rated voltage for a short duration (less than 1 second). However, it's recommended to consult Bourns' application notes for specific guidance on voltage stress and derating.
While the PM5022-3R3M-RC is designed for general-purpose use, it may not be suitable for high-frequency applications (above 1 MHz) due to its core material and construction. Consult Bourns' high-frequency inductor offerings for suitable alternatives.
Use proper shielding, grounding, and layout techniques to minimize EMI and radiation. Consider using a shielded inductor or a ferrite bead in series with the inductor to reduce radiation.
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